By Topic

Effects of 3D shapes in PWB design

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
T. Peltola ; Asperation Oy, Tampere, Finland ; P. Mansikkamaki ; E. O. Ristolainen

Nowadays the outlook of any device can be a more important issue than the technical features inside it. Inevitably all these new and interesting features must be covered with a successfully designed package. Traditional rigid printed wiring board (PWB) can be a restriction for the designer, and, therefore, in some futuristic and novel designs, it is not used any more. A formable 3D multilayer PWB can be an answer for a faddish package without a traditional PWB. Formability brings 3D shapes into the PWB that will introduce new challenges to overcome. This paper discusses the role of 3D shapes in PWB design, and presents one solution to overcome these challenges. By designing a unique support structure for each 3D shape the inconvenient distortions can be controlled. Support structures enable the designers to use formable multilayer structures effectively, and the design freedom is one step closer.

Published in:

Proceedings Electronic Components and Technology, 2005. ECTC '05.

Date of Conference:

31 May-3 June 2005