Skip to Main Content
We have developed a solder joint material with a plastic core. In this paper, we report on the thermal conductivity of this material. We evaluated the thermal resistance θ j-a with 352pin EBGA and 352pin PBGA, and also carried out a thermal conductivity analysis using computer simulation. The result shows that the θ j-a of the 352pin EBGA was 12°C/W, θ j-a of the 352pin PBGA was 20°C/W. So this material is applicable for high frequency and power package (CPU, MCM, MCP, stacked package and so on).