Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

Incorporation of impedance boundary conditions into an advanced, integral equation, full-wave simulator

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Yi Cao ; Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA ; Zhaohui Zhu ; Xing Wang ; Dvorak, S.L.
more authors

In this paper, we incorporate the surface impedance boundary condition into a MoM-based full-wave layered interconnect simulator (UA-FWLIS) to make it capable of handling conductor losses. By introducing an effective surface current and a surface impedance, the losses on the interconnects can be easily included in UA-FWLIS by adding an extra term to the reaction elements. In addition, the losses on the power/ground planes can also be handled by modifying the Green's function without affecting the angular integral in the reaction element calculation. Thus, the approach for analytically calculating the integrals in the reaction matrix, which uses readily computable ILHIs and residue theory, is still valid and the efficiency of UA-FWLIS can be retained. Comparing the S-parameter results from UA-FWLIS with those from agilent momentum validates the accuracy of the enhanced UA-FWLIS.

Published in:

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Date of Conference:

31 May-3 June 2005