Close category search window
 

Extracting of silicon carbide schottky diode model parameters using lateral optimization method including the parallel conductance

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)

In this study, A nonlinear least squares optimization algorithm is used for extracting Silicon carbide Schottky parameters of the single model is presented Parameters values were extracted using this method from experimental characteristics collected .from Tungsten (W), Nickel (Nt) and Molybdenum (Mo) Schottky on 4H-SiC under forward and reverse bias and at different temperatures. The method is found to be reliable and accurate in situations where the model is a good approximation of Schottky diode performance. The diodes showed a barrier height of ϕb = 1.013eV for Mo and ϕb = 1.15 eV for Wand ϕb = 1.57 eV for Ni. The diodes showed also a series resistance in the range of 6 Ω to 15 Ω and a shunt conductance in the range of 10-12 S to 10-11 S The ideality factor is close to unity. Indications are given on the validity of the used technique and its main limitations.

Published in:
Advanced Semiconductor Devices and Microsystems, 2004. ASDAM 2004. The Fifth International Conference on

Date of Conference: 17-21 Oct. 2004

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.