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A study on etching profiles of sacrificial layers

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4 Author(s)
Wu Chang-ju ; Dept. of Inf. Sci. & Electron. Eng., Zhejiang Univ., Hangzhou, China ; Jin Zhoug-he ; Ma Hui-lian ; Wang Yue-lin

Chemical etching of sacrificial layers is a widely used technique in surface micromachining. The causes of the triangle at the etch front are analyzed. The viewpoint that stress is the major factor of the triangle's formation is put forward. Through a study of the mechanism of the effects of annealing on etch rate, several rules about different annealing conditions having different effects on the etch rate are advanced.

Published in:
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on  (Volume:3 )

Date of Conference: 18-21 Oct. 2004

Page(s):
1852 - 1855 vol.3
Print ISBN:
0-7803-8511-X
INSPEC Accession Number:
8412163
Digital Object Identifier :
10.1109/ICSICT.2004.1435196
Product Type:
Conference Publications

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