Cart (Loading....) | Create Account
Close category search window
 

Stabilizing contact resistance of conductive adhesives on Sn surface by novel corrosion inhibitors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Yi Li ; Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Kyoung-Sik Moon ; Wong, C.P.

Electrically conductive adhesives (ECAs) have been proposed as one of the major alternatives for tin/lead solders in electronic packaging. However, some critical limitations of this technology, such as lower electrical conductivity and unstable contact resistance during elevated temperature and humidity aging, have slowed its potentially wide applications in electronics industry. In this study, novel organic corrosion inhibitors were discovered and introduced into a typical ECA formulation. With the incorporation of small amount of the additives, much lower bulk resistivity of ECAs and significantly stabilized contact resistance on Sn surfaces could be achieved. Contact angle and FTIR characterization indicated the affinity and interaction between the corrosion inhibitors and the metal surfaces. Therefore, a barrier passivation layer could form on Sn surfaces for ECA with the effective corrosion inhibitors. X-ray diffraction analyses confirmed that such a passivation layer could protect the Sn surface and prevent oxidation and corrosion under the elevated temperature and humidity environment.

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on

Date of Conference:

16-18 March 2005

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.