By Topic

Substrate effects on the creep properties of pure Sn solder joints

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Kyu-Oh Lee ; Dept. of Mater. Sci. & Eng., California Univ., Berkeley, CA, USA ; J. W. Morris ; F. Hua

This study investigated the influence of substrate metallization on the microstructure and creep behavior of the pure tin solder joints. Both symmetric (Cu:Cu) and the asymmetric (Cu:Au/Ni) metallizations were tested. The solder joints with asymmetric substrates had lower creep rates than those with symmetric (Cu:Cu) substrates. (Cu-Ni)6Sn5 intermetallics formed on all substrates. However, a dramatic and anomalous intermetallic growth was observed on the Ni-side of the asymmetric joints; after typical reflow the intermetallic reached almost one third of the solder joint thickness. It appears that the abnormally thick intermetallic inhibits creep in the asymmetric joint and is the primary cause of the lower creep rates.

Published in:

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.

Date of Conference:

16-18 March 2005