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New solutions for high frequency electronic packaging

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1 Author(s)
W. P. Siebert ; Dept. of Inf. Technol. & Media, Mid Sweden Univ., Ostersund, Sweden

A new concept for shielded enclosures of electronics is presented in this paper. An inexpensive doubled heat sink in extruded aluminum forms the base of the enclosure. The electronics are inserted into one part and is enclosed by a complementary shielding surface. The outer heat sink is cooled by forced ventilation. As openings are made redundant, seams between the parts of the enclosure are the only path for significant electromagnetic emissions. EMC-issues are also addressed in this paper; seams are modeled and simulated as short wave guides intercepted by screw joints. The simulations were carried out in CST Microwave Studio.

Published in:

Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on  (Volume:2 )

Date of Conference:

11-16 May 2003