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Summary form only given. There is one universal truth in terms of design for manufacturing (DFM) - DFM tools and disciplines have always existed. In micron technologies, DFM methodologies were applied to ensure acceptable yield and adequate test coverage. However, nanometer technology has ushered in new and significant yield and manufacturing considerations and constraints. The lack of a major increase in yield improvement between the 350 nm and 180 nm nodes suggests that yield loss mechanisms are not only increasing, but they are increasing fast enough that 'cosmetic' improvements in tools and methodologies are largely offset. If EDA tools are to assist the semiconductor industry at the 90 nm and 65 nm nodes, there must be profound changes to existing tools, and the introduction of new technologies that allow designers to consider and optimize for manufacturing at each stage of the design, verification, tapeout and test process. Where will these new tools and capabilities appear? They will show up in all parts of the design flow, and also on the manufacturing floor. In particular, an immediate focus for the EDA industry must be to deliver new technology in four key areas: process modeling (electrical and lithographic); statistical analysis and visualization; design optimization; test and inspection.