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Investigation of gross die per wafer formulas

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1 Author(s)
D. K. de Vries ; Philips Semicond., Crolles, France

Different forms of gross die per wafer formulas are investigated with respect to the accuracy in which they model the exact gross die per wafer count, as a function of die area and die aspect ratio. Coefficients are given with which the different formulas provide a sufficiently accurate model. To model the aspect ratio dependence, it is found that the mean of die width and die height should be used as a parameter.

Published in:

IEEE Transactions on Semiconductor Manufacturing  (Volume:18 ,  Issue: 1 )