By Topic

A boundary integral equation model for extracting frequency-dependent impedance of 3-D interconnects in VLSI

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Xiaobo Guo ; Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China ; Wenjian Yu ; Zeyi Wang

The accurate extraction of high frequency impedance of the 3D complex interconnects depends mainly on calculation of the 3D eddy current problem. The purpose of this paper is to put forward a boundary integral equation model for calculation of the 3D eddy current problem, which employs two separate imaginary sources, distributed over the interfaces of different regions, and the scalar potential on these interfaces as unknowns. As a boundary element method, this model avoids volume discretization of the conductors and substrate, endowing it with a potential speed. advantage. This model can be used to calculate mutual impedance between two perpendicular conductors by discarding the assumption that the current flows only along the axis direction of the conductors. Furthermore, it is applicable to general 3D structures. The validity of the new model is verified by the numerical results from several simple examples.

Published in:

Communications, Circuits and Systems, 2004. ICCCAS 2004. 2004 International Conference on  (Volume:2 )

Date of Conference:

27-29 June 2004