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Printed circuit board recycling: a state-of-the-art survey

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4 Author(s)
Jianzhi Li ; Ind. Eng. Dept., Texas Tech Univ., Lubbock, TX, USA ; P. Shrivastava ; Zong Gao ; Hong-Chao Zhang

This survey is done with an intention of providing a clear and comprehensive review of current practices and recent developments in the area of printed circuit board (PCB) recycling. The aim of this paper is to be a reference for research and implementation for the PCB recycling process. Original information is collected from the companies engaged in the PCB recycling industry and articles published after 1990. The paper gives an overview of the PCB structure, material composition and different recycling processes.

Published in:

IEEE Transactions on Electronics Packaging Manufacturing  (Volume:27 ,  Issue: 1 )