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Non-contact fast wafer metrology for ultra-thin patterned wafers mounted on grinding and dicing tapes

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8 Author(s)
Walecki, W. ; Frontier Semicond., San Jose, CA, USA ; Suchkov, V. ; Phuc Van ; Lai, K.
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We present application of low coherence optical interferometry to measurement of highly warped samples(characterized by bow of up to 8mm and beyond on 300mm diameter wafers).

Published in:
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International

Date of Conference: July 14-16, 2004

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