Referenced Items are not available for this document.
In this paper, cryogenic aerosol processing for enhancing final device yield in state-of-art 180 and 130 nm devices is demonstrated. Significant advantages of this particle removal technology is demonstrated and discussed: excellent particle removal efficiency on both hydrophilic and hydrophobic surfaces, no watermarks, no feature damage, no charge induced damage and no film modification or loss.
Published in:
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Date of Conference: 4-6 May 2004
- Page(s):
- 467 - 471
- Print ISBN:
- 0-7803-8312-5
- INSPEC Accession Number:
- 8072780
- Digital Object Identifier :
- 10.1109/ASMC.2004.1309616
- Product Type:
- Conference Publications
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