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As Intel has moved into 300 mm manufacturing, we have identified key fab layout and material handling integration lessons. By incorporating learnings from our first generation facilities, we believe our new fabs are well positioned to provide efficient operations and the cost benefits expected from 300 mm. Now we are exploring the issues faced in enhancing our initial 300 mm factories as well as converting our 200 mm facilities in a cost effective manner. In addition, we have also started to look at a couple of key issues facing process development in the highly automated 300 mm environment: split/merge operations, and ad-hoc processing. Identifying solutions in these areas is important to allow technology to continue at the demanding pace of Moore's law.
Date of Conference: 4-6 May 2004