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Throughput analysis and productivity enhancement for CVD equipment

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4 Author(s)
Joo-Pyo Hong ; Semicond. Bus., Samsung Electron. Co. Ltd., Gyeonggi-Do, South Korea ; Jung-Kyoo Kim ; Jae-Hyun Han ; Seung-Ki Chae

A method for throughput analysis and productivity enhancement of FAB equipment is introduced in this paper. The simultaneous movement of the wafers in the equipment was observed from the graph that was generated based on the wafer history log or the event log of the equipment. The efficiency of the equipment and the productivity of the cluster tool were analyzed based on the tables and the graph. It was verified from the analysis that the equipment was in the transfer bottleneck or the process bottleneck condition. If the equipment was in the transfer bottleneck, actions for the productivity enhancement of the equipment were carried out in transfer viewpoint. Or, if the equipment was in the process bottleneck, the actions were carried out in process viewpoint. Some examples of the throughput analysis and the productivity enhancement for the CVD equipment were shown.

Published in:

Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop

Date of Conference:

4-6 May 2004