Close category search window
 

Exploring the limits of high temperature thermal processing for advanced 8-inch power technology manufacturing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

30 Author(s)
Rupp, T. ; Infineon Technol. AG, Villach, Austria ; Dyroff, N. ; Gaertner, T. ; Gross, T.
more authors

Power processes are a challenge for 8-inch production especially in thermal processing. The temperatures exceed those used in DRAM and LOGIC by far and make a detailed knowledge of the critical process limits and maximum temperatures mandatory. We describe the experimental evaluation of these limits and compare the results to theoretical models, for both horizontal and vertical furnace equipment. Bulk micro defects are shown to be a key factor for any thermal process. We investigate in detail the key parameters for the different process regimes of boat push/pull, ramping as well as the impact of different boat and furnace equipment.

Published in:
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop

Date of Conference: 4-6 May 2004

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.