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Equipment maintenance focus in defect density improvements IBM microelectronics, Burlington, Vermont

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2 Author(s)
Bilodeau, M.P. ; IBM Microelectron., Burlington, VT, USA ; Delibac, W.D.

In this paper, the process used to increase equipment maintenance involvement in defect density reductions was discussed. Summaries of some of the key actions that were executed as a result of this ongoing process will be described. The long-term results in defect density improvements realized after over 1.5 years of this process will be summarized in this paper.

Published in:

Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop

Date of Conference:

4-6 May 2004