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In this paper, thermal networks for modeling packages are rigorously introduced. A multipoint moment matching method for state space reduction of these discretized thermal networks is formulated. In this manner reduced thermal networks are derived that can be used as boundary condition independent compact thermal models of packages. This algorithm is successfully applied to the detailed analysis of an idealized ball grid array package.
Published in:
Components and Packaging Technologies, IEEE Transactions on
(Volume:27
,
Issue:
1
)
Date of Publication: March 2004
- Page(s):
- 96 - 103
- ISSN :
- 1521-3331
- INSPEC Accession Number:
- 8090980
- Digital Object Identifier :
- 10.1109/TCAPT.2004.825796
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 19 April 2004
- Issue Date :
- March 2004
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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