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Predicting the strength of underfill/polyimide interfaces

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2 Author(s)
Pearson, R.A. ; Dept. of Mater. Sci. & Eng., Lehigh Univ., Bethlehem, PA, USA ; Oldak, R.

Epoxy/polyimide interfaces are often found in microelectronics. Underfill/polyimide interfaces are found in many flip-chip packages. The strength of such interfaces is of paramount importance to reliability. As our understanding of interfacial phenomena grows, so does our ability to produce strong interfaces. This paper examines the underlying factors controlling the strength of underfill-polyimide interfaces.

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on

Date of Conference:

2004