By Topic

A novel technique for lead-free soldering process using variable frequency microwave (VFM)

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Kyoung-Sik Moon ; Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Yi Li ; Jianwen Xu ; Wong, C.P.

A variable frequency microwave (VFM) was used for soldering the lead-free solders. Melting the Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn46Pb solder pastes and their wetting on the metal pads were achieved by heating the organic flux vehicle through a radio frequency microwave. The lead-free solder interconnection between the component chips and the metal pads through VFM was first demonstrated. The microstructures of the lead-free solders/Cu and Sn surface joints formed by a conventional thermal reflow process and VFM were analyzed. From the intermetallic compound (IMC) formation study, it was found that more heat energy could be employed into the solder paste by the VFM heating process than by the thermal reflow process at the peak temperatures used in this study, because VFM provided more uniform heat than the reflow oven that may lead a temperature gradient in the test boards. It is believed that by VFM the soldering process at a lower peak temperature could be feasible than by a conventional reflow process.

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on

Date of Conference:

2004