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Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

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7 Author(s)
Aggarwal, A.O. ; NSF Microsystems Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA ; Raj, P.M. ; Abothu, I.R. ; Ravi, D.
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This work explores novel material synthesis routes towards reworkable nano-dimensional interfaces for IC-package assembly, leading to bumpless and nano interconnections. Reworkability is addressed by a thin interface of lead-free high-strength solders. Two approaches, sol-gel process and electroless plating, were used to achieve these nano-dimensional bonding interfaces. In the sol-gel process, metal-organic polymer solutions were heat-treated in a reducing atmosphere at 400°C to form lead-free solders (Sn-Ag-Cu). In the electroless plating approach, lead-free alloy films were deposited from aqueous plating solutions consisting of suitable metal salts and reducing agents. This process was done at a temperature of 45°C. The lead-free solder composition was controlled by altering the plating bath formulation. Solder films formed from both the above approaches were demonstrated to bond copper pads. Solution-derived nano-solder technology is an attractive low-cost method for bumpless nano-interconnects and other applications such as MEMS hermetic packaging and compliant interconnect bonding.

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on

Date of Conference:

2004