By Topic

Harsh military environments and microelectromechanical (MEMS) devices

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Brown, T.G. ; U.S. Army Res. Lab., APG, MD, USA

The harsh military environment including operational requirements (temperature, pressure, acceleration and vibration) is described for a few munition applications. A summary of ground based experimentation pertaining to MEMS devices is presented. Results of a high-g shock study suggest that some Microelectromechanical (MEMS) sensors are rugged enough to survive both low-g and high-g launch. Small sensitivities to temperature, shock and vibration are described for a MEMS angular rate sensor. Flight experiments with artillery and rockets instrumented with MEMS angular rate sensors, accelerometers, and telemetry units, were recently completed. Analysis of the angular rate sensor data show encouraging results for surviving and measuring munition pitching and yawing behavior. There is mention of future military applications for MEMS and needed requirements to enable a successful transition.

Published in:

Sensors, 2003. Proceedings of IEEE  (Volume:2 )

Date of Conference:

22-24 Oct. 2003