By Topic

Powder LSI: an ultra small RF identification chip for individual recognition applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)

A powder-like 0.09 mm/sup 2/ 2.45 GHz RF identification chip for wireless recognition applications is described. This chip is fabricated in a 0.18 /spl mu/m CMOS process, and its thickness is 60 /spl mu/m. A two-surface connection technique is adopted to facilitate antenna attachment. The distance between the chip and a reader is 300 mm for a reader power of 300 mW.

Published in:

Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC. 2003 IEEE International

Date of Conference:

13-13 Feb. 2003