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The die-attach adhesive used in CSP (Chip Size Package) is a crucial component that determines the reliability of CSP. This paper will describe a die-attach adhesive film with high reliability that has been developed using ePTFE (expanded polytetrafluoroethylene). Two structures have been made: tri-layered and mono-layered adhesive films and their characteristics and differences are studied. Also, thermal residual stress and warp deformation behavior of BOC (Board On Chip) and the μBGA® package are analyzed with a viscoelasticity simulation. It is determined from this simulation that a BOC package using thin mono-layered adhesive film has nearly the same reliability as μBGA®.