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New high reliability IC bonding film and its development

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5 Author(s)
Ganatra, C.P. ; W.L. Gore & Assoc. Inc, Elkton, MD, USA ; Ohashi, K. ; Tabuchi, Y. ; Yokomizo, O.
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The die-attach adhesive used in CSP (Chip Size Package) is a crucial component that determines the reliability of CSP. This paper will describe a die-attach adhesive film with high reliability that has been developed using ePTFE (expanded polytetrafluoroethylene). Two structures have been made: tri-layered and mono-layered adhesive films and their characteristics and differences are studied. Also, thermal residual stress and warp deformation behavior of BOC (Board On Chip) and the μBGA® package are analyzed with a viscoelasticity simulation. It is determined from this simulation that a BOC package using thin mono-layered adhesive film has nearly the same reliability as μBGA®.

Published in:

University/Government/Industry Microelectronics Symposium, 2003. Proceedings of the 15th Biennial

Date of Conference:

30 June-2 July 2003