Referenced Items are not available for this document.
A method for de-embedding the scattering parameters matrix for single-end or differential through, buried, and blind via holes in multilayer printed circuit boards for high-speed digital applications is presented. The proposed technique starts from a measurement or simulation of the structure containing the discontinuity and, after the structure's partitioning, extracts the scattering parameters of the required discontinuity. The procedure is applied to different kinds of single-ended and differential via holes and is validated by measurements. The finite integration technique is used to perform the needed three-dimensional electromagnetic simulations. Due to its reduced CPU time, the proposed methodology is suitable for a parametric analysis on the electrical performance of the via hole discontinuities and it gives useful results for the extraction of accurate computer-aided design models.
Published in:
Mobile Computing, IEEE Transactions on
(Volume:2
,
Issue:
2
)
Date of Publication: April-June 2003
- Page(s):
- 174 - 184
- ISSN :
- 1536-1233
- INSPEC Accession Number:
- 7785504
- Digital Object Identifier :
- 10.1109/TMC.2003.1217237
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 04 August 2003
- Issue Date :
- April-June 2003
- Sponsored by :
- IEEE Computer Society
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