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In this work a new test structure for mismatch characterization of CMOS technologies is presented. The test structure is modular, with a reduced area and it can be inserted in the space between the dies (scribe lines) on the wafers. The test structure has been implemented in a standard 0.18-μm digital CMOS technology.
Circuits and Systems, 2003. ISCAS '03. Proceedings of the 2003 International Symposium on (Volume:5 )
Date of Conference: 25-28 May 2003