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Browse Journals & Magazines > Components and Packaging Tech ...> Volume:26 Issue:1 Help

Special section on compact thermal modeling

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1 Author(s)
Lasance, C. ; Philips Research Laboratories

First Page of the Article

Published in:
Components and Packaging Technologies, IEEE Transactions on  (Volume:26 ,  Issue: 1 )

Date of Publication: March 2003

Page(s):
134 - 135
ISSN :
1521-3331
Digital Object Identifier :
10.1109/TCAPT.2003.814000
Product Type:
Journals & Magazines
Date of Current Version :
05 June 2003
Issue Date :
March 2003
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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