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Browse Journals & Magazines > Components and Packaging Tech ...> Volume:26 Issue:1 Help

Special section on components and packaging technologies with contributions from ITherm 2002 thermal management track

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4 Author(s)
Amon, C.H. ; Carnegie Mellon University ; Ramakrishna, K. ; Sammakia, B.G. ; Joshi, Y.K.

First Page of the Article

Published in:
Components and Packaging Technologies, IEEE Transactions on  (Volume:26 ,  Issue: 1 )

Date of Publication: March 2003

Page(s):
3 - 5
ISSN :
1521-3331
Digital Object Identifier :
10.1109/TCAPT.2003.810756
Product Type:
Journals & Magazines
Date of Current Version :
05 June 2003
Issue Date :
March 2003
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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