Referenced Items are not available for this document.
The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics and is also addressed in this paper.
Published in:
Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI
Date of Conference: 31 March-1 April 2003
- Page(s):
- 250 - 254
- ISSN :
- 1078-8743
- Print ISBN:
- 0-7803-7681-1
- INSPEC Accession Number:
- 7726227
- Digital Object Identifier :
- 10.1109/ASMC.2003.1194502
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
