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Implementing fiducial probe card alignment technology for production wafer probing

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4 Author(s)
D. Langlois ; Altis Semicond. Inc., Essones, France ; M. Fardel ; K. R. Heiman ; Fenglei Du

To match the ever-increasing density and performance of integrated circuits, new generations of probe cards are getting adopted in the main stream manufacturing process in a rapid pace. To match the product geometry and performance, probe tips are getting increasingly denser, product refined, and miniaturized. The appearances of these tips vary significantly between different technologies, wear and tear of the card, and even the cleaning technology used. To support the increasingly thorough testing process and fast product cycle, probers have to align the probe card automatically, reliably, quickly, and accurately. This poses great challenges to current technology. It takes a significant amount of time and effort for a prober to support new types of probe cards. To address this issue and issues related to test cell management and interoperability of probe card on different probers, we propose a new probe card support process centered on fiducials. Unlike individual probe tips, fiducials are probe card technology neutral and does not change appearances due to wear and tear. They provide reliable and accurate landmarks across different platforms. The proposed technology supports and enhances efficient communication between probe card manufacturers, prober manufacturers, and wafer manufactures. It provides effective means for semiconductor manufacturers to automate probe card setup, tracking, management, and utilization.

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI

Date of Conference:

31 March-1 April 2003