By Topic

Image field upgrade to improve tool productivity

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Dahmen, M.J. ; Process Eng. & Dev., Infineon Technol. Austria AG, Villach, Austria ; Kenyon, G.O.

Some semiconductor tools are used for the development of products and at the same time, stay a long time within production. Process requirements may change during the lifetime of a tool - photolithography of critical layers, for example, may get even more critical due to CD and overlay requirements. The same tool may now be used for non-critical layers, but productivity will always be important. Productivity is measured in wafers per hour (wph) and the image field size of a stepper plays a large role in this productivity. The main contribution of this paper is the realization that an increased image field size on an Ultratech 1X stepper gives increased wafers per hour on both a 5X Canon i-line reduction stepper and the 1X Ultratech stepper.

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI

Date of Conference:

31 March-1 April 2003