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Resist stripping process development for porous low-k dielectric materials

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4 Author(s)
Xu, Han ; ULVAC Technol., Inc., Methuen, MA, USA ; Jacobs, T. ; White, Brian ; Wolf, P.Josh

In this paper, we will report the result of developing resist strip processes compatible with low-k materials at International Sematech (ISMT) using a standalone Ulvac Environ™ resist stripping system with dual plasma sources. Processes with non-oxygen chemistry were successfully developed and characterized for several non-porous low-k materials, such as spin-on hybrid siloxane-organic polymer and CVD OSG. However, extensive experiments performed on porous MSQ low-k materials reveal the need for directional resist stripping and low wafer temperatures to avoid damage to porous low k materials. Desirable process results were achieved for the porous low-k film in the modified Enviro™ chamber with turbo molecular pump and electrostatic chuck.

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI

Date of Conference:

31 March-1 April 2003