By Topic

Productivity enhancement using a methodical approach to defect reduction based on synergy of process and defect metrology knowledge

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

17 Author(s)
Schreutelkamp, R. ; Technol. Group Philips Account, Appl. Mater. Eur., Nijmegen, Netherlands ; van der Reijden, M. ; King, T. ; Mast, K.
more authors

Increased process equipment complexity and cost related to tool down time stimulate a stronger partnership between chip manufacturer and process equipment vendor to minimize the risk to production. Applied Materials is engaged in various process equipment-related service programs at customer manufacturing sites ranging from complementation of the manufacturer's own factory service organization to full ownership of equipment. In this paper, we discuss one aspect of service offerings that targets at defect reduction and productivity enhancement. Successful implementation at Philips Semiconductors of a methodology to perform defect reduction and productivity enhancement programs is discussed. Examples of using the described methodology are provided in this paper for programs targeted at DO baseline defect density reduction, mean wafer between clean (MWBC) improvement, and limitation of yield loss related to intermittent particle bursts.

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI

Date of Conference:

31 March-1 April 2003