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Increased process equipment complexity and cost related to tool down time stimulate a stronger partnership between chip manufacturer and process equipment vendor to minimize the risk to production. Applied Materials is engaged in various process equipment-related service programs at customer manufacturing sites ranging from complementation of the manufacturer's own factory service organization to full ownership of equipment. In this paper, we discuss one aspect of service offerings that targets at defect reduction and productivity enhancement. Successful implementation at Philips Semiconductors of a methodology to perform defect reduction and productivity enhancement programs is discussed. Examples of using the described methodology are provided in this paper for programs targeted at DO baseline defect density reduction, mean wafer between clean (MWBC) improvement, and limitation of yield loss related to intermittent particle bursts.