By Topic

Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Zhang, Z. ; Bradley Dept. of Electr., State Univ., Blacksburg, VA, USA ; Guo-Quan Lu

Pressure-assisted low-temperature sintering of silver paste is shown to be a viable alternative to solder reflow as a die-attachment solution. A quasihydrostatic pressure is used to lower the sintering temperature. The effect of parameters such as temperature and pressure are investigated. Characterization of the silver-attached samples shows a significant improvement in electrical conductivity, thermal conductivity and mechanical strength of the joint. Given that silver deforms with little accumulation of inelastic strains, and given the absence of large voids in the attachment layer, it is also expected that the joint to be more resistant to fatigue failure than a solder attached junction. Due to the high melting temperature of silver, this alternative process is also suitable for high temperature packages.

Published in:

Electronics Packaging Manufacturing, IEEE Transactions on  (Volume:25 ,  Issue: 4 )