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Thick Film Pastes for Multilayer Use

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2 Author(s)
K. Kurzweil ; Société Honeywell Bull, France ; J. Loughran

Suecessful multilayer processing requires careful selection of conductor and dielectric pastes. As pastes they must satisfy geometrical and processing needs; as conductors and dielectrics they must meet electrical and other requirements. Some dominating considerations for paste selection are reviewed. A method is described for evaluating paste performance with test patterns which simulate multileyer applications. Various popular conductor and dielectric pasteswere evaluated and the results are reported. Some frequently encountered processing problems and their causes are discussed. Although all pastes evaluated were found less than ideal, a satisfactory combination of conductor and dielectric pastes was selected.

Published in:

IEEE Transactions on Parts, Hybrids, and Packaging  (Volume:9 ,  Issue: 4 )