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The cooling of miniaturized equipment is usually handled by forced air flow. An investigation was made of the merits of suction vs pressure cooling, to find an effective cooling design for a certain module assembly. This showed that suction cooling has certain advantages because of the air flow escape from the circuitry section to adjacent spaces. Its air flow pattern provides maximum air accretion at the air exit, which is a critical area. That suction cooling will minimize air temperatures in that area is qualitatively developed and then quantitatively analyzed.