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Integrated Thin-Film Circuits

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3 Author(s)
Maissel, L. ; IBM Corporation,N.Y. ; Simmons, J. ; Casey, M.

This paper describes the fabrication of microminiaturized circuitry using sputtered metals. Experiments proved that it was possible, with special techniques, to use a photosensitive resist (Kodak Metal Etch Resist) as a masking medium for the deposition of circuit components with accurate dimensions. In this instance, a single metal (tantalum) was used to form the passive components. The high sheet resistivity of stable tantalum films permits the fabrication of small resistors, while two-dimensional capacitors can be formed from anodically oxidized tantalum films. This facilitates a unfied approach to microminiaturization.

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Component Parts, IRE Transactions on  (Volume:8 ,  Issue: 2 )