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Analysis and Development of a Thermocompression Bond Schedule for Beam Lead Devices

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2 Author(s)
Adams, J.R. ; Sandia Laboratories, Alberquerque, N. Mex. ; Bonham, H.

To obtain consistent and reliable beam lead device attachment by thermocompression bonding, it is necessary to determine an allowable range of bonding parameters over which the mechanical integrity of the device attachment is optimized. This paper discusses the practical considerations of beam lead wobble tool bonding, and describes the theoretical and experimental techniques which were used to establish the critical bonding variables. Using these techniques a bond schedule has been developed in terms of only two variables, bond force and interface temperature.

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Parts, Hybrids, and Packaging, IEEE Transactions on  (Volume:8 ,  Issue: 3 )