Referenced Items are not available for this document.
The techniques used in producing thin-film circuits are discussed. Conductive, resistive and insulating films are evaporated separately onto glass substrates to form resistors, capacitors and interconnections. Active elements, transistors and diodes are mounted in holes drilled through the substrates. Studies aimed at developing thin-film active elements are discussed briefly. Several possible methods of interconnection are presented.
Published in:
Component Parts, IRE Transactions on
(Volume:7
,
Issue:
2
)
Date of Publication: Jun 1960
- Page(s):
- 37 - 44
- ISSN :
- 0096-2422
- Digital Object Identifier :
- 10.1109/TCP.1960.1136448
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 January 2003
- Issue Date :
- Jun 1960
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