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This paper is concerned with the computer costs for both the steady-state and transient thermal responses of large-scale integrated circuits (LSI) when metal is present within the substrate. For the more cost-sensitive transient case, an extrapolation technique for computer time savings is compared with the accuracy loss in this study. This approach could be useful for design-cost planning.
Parts, Hybrids, and Packaging, IEEE Transactions on (Volume:7 , Issue: 4 )
Date of Publication: Dec 1971