Referenced Items are not available for this document.
This paper is concerned with the computer costs for both the steady-state and transient thermal responses of large-scale integrated circuits (LSI) when metal is present within the substrate. For the more cost-sensitive transient case, an extrapolation technique for computer time savings is compared with the accuracy loss in this study. This approach could be useful for design-cost planning.
Published in:
Parts, Hybrids, and Packaging, IEEE Transactions on
(Volume:7
,
Issue:
4
)
Date of Publication: Dec 1971
- Page(s):
- 168 - 172
- ISSN :
- 0361-1000
- Digital Object Identifier :
- 10.1109/TPHP.1971.1136429
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 January 2003
- Issue Date :
- Dec 1971
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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