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Computer Simulation of the Thermal Environment of Large-Scale Integrated Circuits: Computer Time-Saving Techniques

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2 Author(s)
R. Thompson ; Atlantic Richfield Company,Houston,Tex ; H. Blum

This paper is concerned with the computer costs for both the steady-state and transient thermal responses of large-scale integrated circuits (LSI) when metal is present within the substrate. For the more cost-sensitive transient case, an extrapolation technique for computer time savings is compared with the accuracy loss in this study. This approach could be useful for design-cost planning.

Published in:

IEEE Transactions on Parts, Hybrids, and Packaging  (Volume:7 ,  Issue: 4 )