Referenced Items are not available for this document.
The effects of thermal expansion incompatibility between silicon slices and various metal substrates are described for adhesive and solder joints. Dependable solder and adhesive joints have been achieved in mounting two-inch silicon slices. The size of the sillcon slices that can be solder or adhesive mounted to various substrates and withstand a specified temperature change was experimentally determined. Extrapolation of the present results can predict the suitability of substrate material for mounting larger than 2-in silicon slices. A one-dimensional theoretical model was found to describe the trends of the experimental data.
Published in:
Parts, Hybrids, and Packaging, IEEE Transactions on
(Volume:7
,
Issue:
2
)
Date of Publication: Jun 1971
- Page(s):
- 76 - 80
- ISSN :
- 0361-1000
- Digital Object Identifier :
- 10.1109/TPHP.1971.1136413
- Date of Current Version :
- 06 January 2003
- Issue Date :
- Jun 1971
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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