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Solderless Press-Fit Interconnections: A Mechanical Study of Solid and Compliant Contacts

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1 Author(s)
Scaminaci, J., Jr. ; Elfab Corporation,Dallas,TX

The requirements for economical and reliable interconnections of multiple post terminations have advanced backpanel packaging technology to the use of printed circuit boards, precluding the use of solder and external wire connections. The characteristics of the interfaces between the printed circuit board and the post contact are discussed. The "interference" press-fit contact industry offers two concepts of contact to plated hole interface design. An analysis of these two designs is made with text guidelines underlining design, manufacture, and reliability.

Published in:

Manufacturing Technology, IEEE Transactions on  (Volume:6 ,  Issue: 2 )

Date of Publication:

Jun 1977

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