Scheduled System Maintenance:
On Monday, April 27th, IEEE Xplore will undergo scheduled maintenance from 1:00 PM - 3:00 PM ET (17:00 - 19:00 UTC). No interruption in service is anticipated.
By Topic

Development of a Thermally Conductive Ceramic Component Board

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Kriss, G. ; Missile and Space Vehicle Dept., General Electric Co. ; Polaski, L.

This paper describes the development and evaluation of a ceramic component board having all circuit connections electrically insulated but thermally grounded. Individual circuits are encapsulated in epoxy parallelopipeds having large diameter leads of nickel clad copper wire. The leads in turn are resistance welded to metallic (Kovar) studs which have been brazed into an inorganic (Beryllium Oxide Ceramic) wafer having exceedingly good thermal conductance. Interconnections between weld studs are accomplished by metalized plated runs. The component board assembly was then evaluated under simulated operating conditions, i.e., edge clamped to an infinite heat sink and in a vacuum environment. Internal heat rise within the circuit modules was monitored and compared to that found in another module which had not been welded to the board, and plots of the thermal gradients across the ceramic wafer were made.

Published in:

Product Engineering and Production, IRE Transactions on  (Volume:5 ,  Issue: 2 )