By Topic

A Ceramic Capacitor Substrate for High Speed Switching VLSI Chips

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)

An integrated capacitor substrate which is proposed as an essential part in the realization of a thin film module for high speed digital computing systems is discussed. Several innovative multilayer ceramic (MLC) concepts relative to the fabrication of the desired low inductance capacitor and current paths to chips are described. Ceramic and metal composite material sets which may be used in the fabrication are also proposed. Experimental evaluations of some of the crucial concepts were made and included in the discussions. The result is an elegant approach to the fabrication of one of the key requirements in realizing the thin film high performance module.

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:5 ,  Issue: 4 )