By Topic

Thermal Characteristics of Horizontally Oriented Electronic Components in an Enclosed Environment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Buller, M. ; IBM, Essex Junction, VT, USA ; Duclos, T.

A closed-form expression is derived to correlate experimental data relating the thermal characteristics of electronic hardware in an enclosed system. Due to the geometric constraints sometimes imposed in small system architecture, the analysis concerns itself only with the effect of horizontal orientation. Variations in the enclosed volume create changes in the buoyancy-induced flows which affect the thermal characteristics of an adiabatic fiat plate. Data from the fiat plate study are correlated against additional data using a typical memory card populated with area-pin array modules. The results provide a technique to obtain the surface heat transfer coefficient and thus the natural convection component of the total heat load. Radiation losses, which play a major role in this type of system, are also discussed. A combination of these two components yield the maximum power dissipation allowable to maintain a specified electronic component temperature within an enclosed system with known bulk air temperature limits.

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:5 ,  Issue: 4 )