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High Density Multiwire Circuits Using Thinner Wires

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3 Author(s)
Sugita, Etsuji ; Electronic Equipment Development Division, Japan ; Ibaragi, O. ; Momoi, S.

High density Multiwire circuit technology which can lay two insulated wires between throughholes on 2.5 mm centers has been developed. To reduce crosstalk smaller diameter wires were adopted instead of conventional 0.16 mm diameter wires. Wire breakage and wiring mistakes, which occur in high density wiring, can result from improper wire tacking. A newly developed tackless wiring technique can reduce these problems. The new technology has been applied to backplane wiring boards in an electronic switching system.

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:4 ,  Issue: 2 )

Date of Publication:

Jun 1981

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