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On Possible Thermal Degradation in Spirally Programmed Interconnection Wafer Technology

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1 Author(s)
Begg, I. ; University of St.Andrews,Scotland, U.K

A possible cause of difficulty in utilizing spiral programmed interconnection in full wafer technology is examined. This is the existence of hot spots. It is shown that hot spots are likely to occur and, in which case, to impair seriously the wafer performance. Means of avoiding such degradation are indicated.

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:4 ,  Issue: 1 )