By Topic

On the Physics of Purple-Plague Formation, and the Observation of Purple Plague in Ultrasonically-Joined Gold-Aluminum Bonds

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
G. Chen ; Collins Radio Company of Canada,Canada

The gold wire-aluminum thin-film joint is treated as a diffusion couple at low concentration, but above dilute levels. Electrical resistance of the joint is directly related to the solute concentration and, therefore, is a measure of the thermal annealing process. Annealing temperatures are related through the diffusion length \surd Dt. Effects of temperature and time can be superimposed thereby. Experimental results on ultrasonically-joined gold wirealuminum thin films showed resistance increase with decreasing bond strength. From an Arrhenius-type plot at 105°C, 156°C, and 203°C, the apparent activation energy for thermal annealing of ultrasonically-joined gold wire-aluminum thin-film bonds is found to be 12.8 kcal/mole. The diffusion model is independent of the method by which the two metals are joined, however.

Published in:

IEEE Transactions on Parts, Materials and Packaging  (Volume:3 ,  Issue: 4 )