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There are many cases where a subassembly contains a number of identical or similar elements. Two examples of this are printed circuit boards on which are mounted integrated circuit packages, and ceramic substrates with integrated circuit chips mounted and interconnected. The cost of the finished subassembly is a function of the repairability, number of elements per subassembly, and probability of a mounted device being successful after application. This paper establishes a relationship giving the yield as a function of the above parameters, and gives two application examples.