By Topic

Yield of repairable aggregates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
A. Krell ; RCA Commun. Systems Div. Camden, NJ

There are many cases where a subassembly contains a number of identical or similar elements. Two examples of this are printed circuit boards on which are mounted integrated circuit packages, and ceramic substrates with integrated circuit chips mounted and interconnected. The cost of the finished subassembly is a function of the repairability, number of elements per subassembly, and probability of a mounted device being successful after application. This paper establishes a relationship giving the yield as a function of the above parameters, and gives two application examples.

Published in:

IEEE Transactions on Parts, Materials and Packaging  (Volume:3 ,  Issue: 3 )